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[83030] Artykuł: The efficiency and quality of silicon micromachining above the ablation threshold - a comparison for femto, pico and nanosecond laserCzasopismo: Laser Technology 2018: Progress And Applications Of Lasers Tom: 10974, Strony: 1-8ISSN: 1996-756X ISBN: 978-1-5106-2604-1 Wydawca: SPIE-INT SOC OPTICAL ENGINEERING, 1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA Opublikowano: 2018 Seria wydawnicza: Proceedings of SPIE Autorzy / Redaktorzy / Twórcy Grupa MNiSW: Materiały z konferencji międzynarodowej (zarejestrowane w Web of Science) Punkty MNiSW: 15 Klasyfikacja Web of Science: Proceedings Paper ![]() ![]() Keywords: silicon  laser micromachining  nanosecond  picosecond  femtosecond  IR  UV  |
In the paper the results of 3D micromachining of silicon using nanosecond (1064 nm), picosecond (343 nm) and femtosecond (343 nm) laser pulses are presented. Effective laser processing demands repeated scanning of the laser beam and overlapping of paths what generate many phenomena which do not occur by impact of individual laser pulses. Thermal incubation effect and shielding of laser beam by ejected particles compete and decide on the final result of ablative micromachining. Applying femto and picosecond laser pulses does not directly guarantee expected quality and effectiveness.