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Abstract:

This article presents some results of laser processing of materials, used for the construction of microsystems and microsensors, e.g. Si, Al2O3 and zirconia ceramics. The necessity of exact reproducing the geometry and dimensions in the microscale puts specific requirements for laser machining process. Laser microtechnologies must be conducted under conditions which ensure the perfect guidance of a well-focused laser beam, scanning at a suitable speed, and the laser pulse duration with proper repetition frequency. The amount of absorbed energy depends on wavelength of laser radiation and kind of material, which also influence on this process. All these conditions should take into account the need to maintain a small heat affected zone (HAZ). This guarantees keeping the exact reproduction of microshapes and cutting edges with a different angle of lines even in microscale details. The present work confirms the possibility of using laser technology for such applications.

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Laser Technologies in Microsystems