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[23824] Artykuł: Processing and microstructural characterisation of laminated Ti-intermetallic composites synthesised using Ti and Cu foilsCzasopismo: Materials Letters Tom: 62, Zeszyt: 17-18, Strony: 2600-2602ISSN: 0167-577X Wydawca: ELSEVIER SCIENCE BV, PO BOX 211, 1000 AE AMSTERDAM, NETHERLANDS Opublikowano: Czerwiec 2008 Autorzy / Redaktorzy / Twórcy
Grupa MNiSW: Publikacja w czasopismach wymienionych w wykazie ministra MNiSzW (część A) Punkty MNiSW: 20 Klasyfikacja Web of Science: Article ![]() ![]() ![]() ![]() Keywords: Composite materials  Microstructure  Intermetallic compounds  |
Ti-intermetallic laminated composites were fabricated by reaction synthesis in vacuum using Ti and Cu foils. The copper layers were completely consumed due to the formation of intermetallic phases. The Ti-Cu reaction was studied by interrupting in steps the reaction process to observe the microstructural changes. Microstructural examinations using scanning electron microscopy (SEM) and X-ray microprobe analysis demonstrated that five intermetallic compounds: Ti 2 Cu, TiCu, Ti 3 Cu 4 , Ti 2 Cu 3 , TiCu 4 were formed after heat treatment at 1173 K for 1.8 ks. Heat treatment for 18 ks resulted in a microstructure consisting of Ti and TiCu layers, but with a thick Ti 2 Cu interphase layer. The TiCu layers give high hardness to the composite, while unreacted titanium provides the necessary high ductility.