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[16530] Artykuł:

Diffusion bonding and transient liquid phase joining of titanium to AISI 304 stainless steel with an aluminum interlayer

Czasopismo: Proceedings of 24th International Conference on Metallurgy and Materials - METAL 2015   Strony: 1513-1518
ISBN:  978-80-87294-62-8
Wydawca:  TANGER LTD, KELTICKOVA 62, SLEZSKA, OSTRAVA 710 00, CZECH REPUBLIC
Opublikowano: 2015
 
  Autorzy / Redaktorzy / Twórcy
Imię i nazwisko Wydział Katedra Procent
udziału		 Liczba
punktów
Marek Konieczny orcid logoWMiBMKatedra Technik Komputerowych i Uzbrojenia**335.00  
Bartłomiej Szwed orcid logoWMiBMKatedra Technik Komputerowych i Uzbrojenia**335.00  
Renata Mola orcid logoWMiBMKatedra Technik Komputerowych i Uzbrojenia**335.00  

Grupa MNiSW:  Materiały z konferencji międzynarodowej (zarejestrowane w Web of Science)
Punkty MNiSW: 15
Klasyfikacja Web of Science: Proceedings Paper

Web of Science Logo Web of Science    
Keywords:

Titanium  stainless steel  aluminum  diffusion bonding  TLP joining  microstructure 


Abstract:

Titanium and AISI 304 stainless steel were joined using a 0.1 mm thick aluminum foil interlayer at temperatures of 550, 650 and 700 degrees C for 1 h under 2 MPa pressure in vacuum. The interface microstructures of the bonded samples were observed using the optical and scanning electron microscopes. The chemical analysis was performed with energy dispersion spectroscopy. The effect of bonding temperature on joints microstructure, composition and microhardness was investigated. FeAl3 and Fe2Al5 intermetallic layers were observed at the stainless steel/aluminum interfaces. At the aluminum/titanium interfaces TiAl, TiAl2 and TiAl3 intermetallic layers were identified. The width of intermetallic layers for both interfaces increased gradually with the increase in bonding temperature. The irregular shaped particles of Al7Cr were additionally observed in aluminum matrix for joints that were transient-liquid-phase bonded at 700 degrees C. Microhardness of joints achieved values from 220 to 870 HV and was higher than that one for base metals. The microhardness values for analogous intermetallic layers increased with increasing temperature of bonding.


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