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[84850] Artykuł:

Thermal modeling and simulation of high power LED module

Czasopismo: AIP Conference Proceedings 2078, 020048 (2019)   Tom: 2078, Strony: 1-9
ISSN:  0094-243X
ISBN:  978-0-7354-1806-6
Wydawca:  AMER INST PHYSICS, 2 HUNTINGTON QUADRANGLE, STE 1NO1, MELVILLE, NY 11747-4501 USA
Opublikowano: Marzec 2019
Seria wydawnicza:  AIP Conference Proceedings
 
  Autorzy / Redaktorzy / Twórcy
Imię i nazwisko Wydział Katedra Do oświadczenia
nr 3
Grupa
przynależności
Dyscyplina
naukowa
Procent
udziału
Liczba
punktów
do oceny pracownika
Liczba
punktów wg
kryteriów ewaluacji
Antoni Różowicz orcid logo WEAiIKatedra Elektrotechniki Przemysłowej i Automatyki**Takzaliczony do "N"Automatyka, elektronika, elektrotechnika i technologie kosmiczne25.00.00  
Henryk Wachta Niespoza "N" jednostki25.00.00  
Krzysztof Baran Niespoza "N" jednostki25.00.00  
Marcin Leśko Niespoza "N" jednostki25.00.00  

Grupa MNiSW:  Materiały z konferencji międzynarodowej (zarejestrowane w Web of Science)
Punkty MNiSW: 0
Klasyfikacja Web of Science: Proceedings Paper


Pełny tekstPełny tekst     DOI LogoDOI     Web of Science Logo Web of Science    
Keywords:

Lighting technology 



Abstract:

The article presents the selected issues related to precise thermal modeling of the LED module using CFD
software. Determining the temperature of the junction of semiconductor light sources at the stage of designing the
module or luminaire is essential in the context of determining its impact on reliability, or changing the light parameters
during the operation of the luminaire under real conditions. The obtained simulation research results were modified on
the real object.



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