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Publikacje
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[23824] Artykuł:

Processing and microstructural characterisation of laminated Ti-intermetallic composites synthesised using Ti and Cu foils

Czasopismo: Materials Letters   Tom: 62, Zeszyt: 17-18, Strony: 2600-2602
ISSN:  0167-577X
Wydawca:  ELSEVIER SCIENCE BV, PO BOX 211, 1000 AE AMSTERDAM, NETHERLANDS
Opublikowano: Czerwiec 2008
 
  Autorzy / Redaktorzy / Twórcy
Imię i nazwisko Wydział Katedra Procent
udziału
Liczba
punktów
Marek Konieczny orcid logoWMiBMKatedra Technik Komputerowych i Uzbrojenia**10020.00  

Grupa MNiSW:  Publikacja w czasopismach wymienionych w wykazie ministra MNiSzW (część A)
Punkty MNiSW: 20
Klasyfikacja Web of Science: Article


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Keywords:

Composite materials  Microstructure  Intermetallic compounds 



Abstract:

Ti-intermetallic laminated composites were fabricated by reaction synthesis in vacuum using Ti and Cu foils. The copper layers were completely consumed due to the formation of intermetallic phases. The Ti-Cu reaction was studied by interrupting in steps the reaction process to observe the microstructural changes. Microstructural examinations using scanning electron microscopy (SEM) and X-ray microprobe analysis demonstrated that five intermetallic compounds: Ti 2 Cu, TiCu, Ti 3 Cu 4 , Ti 2 Cu 3 , TiCu 4 were formed after heat treatment at 1173 K for 1.8 ks. Heat treatment for 18 ks resulted in a microstructure consisting of Ti and TiCu layers, but with a thick Ti 2 Cu interphase layer. The TiCu layers give high hardness to the composite, while unreacted titanium provides the necessary high ductility.



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